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  6. Soluble Photosensitive Polyimide Precursor With Bisphenol A Framework: Synthesis And Characterization

Soluble Photosensitive Polyimide Precursor with Bisphenol A Framework: Synthesis and Characterization

Bowen Zheng1, Jing Li1, Ning Li1

  • 1Research Center of Laser Fusion, China Academy of Engineering Physics, Mianyang 621900, China.

Polymers|June 13, 2025

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Summary

Researchers developed a novel photosensitive polyimide film using a soluble precursor (BAFPAE). This material, featuring interpenetrating polymer networks, demonstrates excellent mechanical properties, including high toughness and tensile strength.

Area of Science:

  • Polymer Chemistry
  • Materials Science
  • Organic Synthesis

Background:

  • Development of advanced polymer films with tailored properties is crucial for various technological applications.
  • Photosensitive polyimides offer unique processing advantages, enabling precise patterning and fabrication.
  • Improving the mechanical robustness of photosensitive polyimides without compromising transparency is an ongoing challenge.

Purpose of the Study:

  • To synthesize a novel soluble photosensitive polyamide ester precursor (BAFPAE).
  • To investigate the effects of reaction conditions and functional group incorporation on film properties.
  • To evaluate the mechanical performance and potential applications of the resulting transparent photosensitive polyimide film.

Main Methods:

  • Copolymerization of 2,2-bis [4-(4-aminophenoxy)phenyl]hexafluoropropane (HFBAPP) and 4,4'-(4,4'-isopropylidenediphenoxy)bis(phthalic anhydride) (BPADA).
  • Incorporation of hydroxyethyl methacrylate (HEMA) as a photosensitive functional group.
  • Thermal curing of the precursor film to obtain a transparent polyimide film and systematic investigation of mechanical properties.

Main Results:

  • A soluble photosensitive polyamide ester precursor (BAFPAE) was successfully synthesized.
  • The formation of polyacrylate-polyimide interpenetrating polymer networks (IPNs) was confirmed.
  • The optimized BAF-x-y film exhibited superior mechanical properties: toughness (12.69 MJ m^3), Young's modulus (2.86 GPa), elongation at break (21.16%), and tensile strength (92.68 MPa).

Conclusions:

  • The developed BAFPAE precursor enables the fabrication of transparent photosensitive polyimide films.
  • The incorporation of HEMA and the formation of IPNs are key to achieving excellent mechanical integrity.
  • The material shows significant promise for applications requiring robust and photosensitive polymer films.
Keywords:
bisphenol Amechanical propertiesphotosensitive polyimide (PSPI)polymer networks (IPNs)solubility

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